工艺

可沉积薄膜种类和应用场景包括９�br/>� High-K介电材料 (A,O, H1O, ZrO PrA1Q, Ta, 0s. 1a,0);
� 金屬互联结构 (Cu, WN, TaN, Ru, In);
� 催化材料 (Pt, Ir, Co, TiO, V,0g):
� 生物医学涂层 (TiN, ZIN, TiAIN, AITIN);
•金�?Ru, Pd, Ir Pt, Rh, Co, Cu, Fe, Ni;
� 压电� (ZnO, AIN, ZnS);
� 透明电学导体 (ZnO:Al, ITO);
� 光子晶体(ZnO,ZnSIMn, Ti0, Ta,N.);等、�/p>