• step heights� angles� shapes

• roughness� ripple� waviness

• defects� scratches� wear off

• flatness� coplanarity� deformations

• film thickness (tomographic mode)

Benefitting from Heliotis' long experience with 3D sensors for industrial applications� the H6 combines interferometric precision with robustness and high throughput.

System integrators benefit from ease of integration� a rugged design and designed-in reliability. The H6 is applicable to a wide range of inspection tasks and produces repeatable results on difficult targets such as hybrid metal/Polymer objects.

Equipment manufacturers benefit from the modular architecture of the H6 platform� access to sophisticated firmware features� software development kits and Heliotis' design-in expertise. The standard capabilities may be extended by custom features (e.g. optics� CMOS image sensor� electronics� FPGA� software� mechanics).

industrial White-Light Interferometer

compatible with exchangeable heliOptics? WLI6 interferometer modules

resolution RMS

(phase mode)

70 nm

(1 nm)

CSPs and micro-BGAs continue to increase the packaging density of PCBs� but the ever shrinking pad sizes make it harder to ensure the reliability of the solder joints. Advanced 3D-profiling provides reliable data on solder height and solder volume to fine-tune the screen printer configuration� monitor process statistics for SPC and increase First Pass Yield.

Likewise� the requirement on technical surfaces typically increases with miniaturization as surfaces roughness become more significant and tolerances smaller. True 3D-inspection yields unambiguous quality data and can provide feedback to the manufacturing process.

Miniaturization allows for innovative products with superior performance at reduced costs. Devices such as MEMS and micro-optics make use of production techniques originally developed for integrated circuits. With dimensions down to the micro-meter range� conventional inspection systems are no longer appropriate - especially where three dimensional accuracy needs to be verified.

The M3 helps the developer to quickly gain an in-depth understanding of the true 3D shapes produced by a set of process parameters. The M3 takes 3D profiles of almost any material (reflective and diffusive). For inspection no preparation of the devices is necessary.

The M3 delivers quantitative topological and tomographic data of biological samples in high resolution. Its non-invasive and non-contact measurement principle p-OCT works with non-ionizing visible or near infrared light.

In contrast to scanning electron microscopes� the samples do not need to be coated or evacuated. Thus� the M3 allows for rapid characterization of biological samples and even delivers quantitative 3D data.

Fnology is used for comparing cartridge cases from crime scenes� demonstrating superior performance over legacy 2D systems. Furthermore� the detailed 3D-metrology is instrumental in detecting counterfeits and forgery.

There are numerous possibilities for innovative security products based on micro 3D-features. The M3 is the perfect tool for creating it.