Automated lapping machine (LM 500)

The LM 500 is a bench floor single-plate lapping machine� utilized to flatten the chip face which will be glued to a slide and to perform the final thin section sample thickness reduction. The powerful apparatus can simultaneously process up to 6 chips or 24 thin sections� with an exceptionally high degree of surface finish. By removing subsurface damage caused by sawing and grinding� the desired specimen thickness and evenness are achieved. The device is mainly composed of a rotating grooved cast iron plate� a chip lapping jig� a precision thin section lapping jig� a lapping thickness tuning tool� an unevenness correction rim and an abrasive fluid (e.g. silicon carbide) dispensing and recycling system. Via a control panel� the operator can manually control the apparatus or run it in the automatic mode.

FEATURES:

Specimen size: 30x45mm� 1 inch x 1.5 inch (small size)

60 x 45mm or 1 inch x 3 inch (large size)

Jig capacity : according to jig model Variable speed: 20 to 75 RPM

Plate diameter: 500 mm

Timer: 0-10 hours Dimensions: 700 x 700 x 1�?00 mm

Weight: 250 kg

Power supply: 220 VAC - 50/60 Hz

BENEFITS:

* Vibration-free at low speeds

* Laps chips and thin sections

* Easy access for rapid and effortless cleaning

* High simultaneous processing rate

* Automated operations