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其主要工作原理是，通过压电陶瓷将电信号转换成超声波＇20KHz），用超声波对样品内部进行高精度地扫描，根据超声波在不同密度材料中的传播速度和反射系数的差异，获得样品内部不同区域的超声波透射或反射，再经由软件算法处理和成像。SAM的核心构成为，电气部件、机械装置、声学部件、软件系统、/span>
SONIX ECHO VS?是专为更高精度要求，更复杂元器件设计的新一代设备、/p>
广泛应用 Flip chips，Stacked die，Bumped die，Bonded wafers 等、/span>
高分辨率下，扫描速度是传统超声波扫描显微镜的2.5倌/p>
独有的波形模拟器(Waveform Simulator)及波束仿?Beam Emulator)
扫描分辨率小?微米
水温控制系统及紫外杀菌系统超高频状态工作下，信号更稳定
To identify the smallest and most subtle defects in leading-edge packaged microelectronic applications ECHO VS includes standard features such as heated water for optimum acoustic coupling Flexible TAMI for efficient capture of the most useful data Waveform Averaging for an improved signal-to-noise ratio ICEBERG for improved image quality and MFCI for enhanced image quality in the most demanding applications. ECHO VS is the ultimate ultrasonic NDT equipment for molded flip chip CSP MCM stacked die MUF and other advanced packaging technologies.
Detects air defects as thin as 0.01 micron and spatially resolves defects down to 5 microns.
Image Enhancement Suite with heated water waveform simulation and other innovations for industry-leading image quality in advanced packaging applications
Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers
Waveform averaging for improved signal-to-noise ratio
Transducers from 15MHz through 300MHz designed and matched in-house to address all types of applications and materials
Stacked Die Imaging (SDI) (optional)
Molded Flip Chip Imaging (MFCI)
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