选用优质人造单晶金刚石（HPHT）为原料，通过破碎、整形、提纯、分级、清洗等生产工艺制成的超细磨料、�/span>

产品特点９�span style="font-weight: 700; font-family: arial, helvetica, sans-serif; color: rgb(12, 12, 12); font-size: 16px; background-color: rgb(84, 141, 212);">

›�/span>可控的颗粒形状（磨圆、块状、不规则状）、�/span>

›�/span>集中的粒度分布、�/span>

›�/span>极低的杂质含量、�/span>

›�/span>良好的分散性能、�/span>

应用领域９�br/>

›�/span>半导体领域：碳化硅晶片切割、研磨；蓝宝石晶片的切割、研磨等、�/span>

›�/span>智能穿戴及光通信领域：手机、智能手表构件的高精度扫磨等；光纤连接器的研磨抛光、�/span>

›�/span>石油地质：金刚石复合片的生产、�/span>

›�/span>超硬材料制品制备：金刚石线锯、砂轮、复合片、软磨片、拉丝模具、研磨液、研磨膏等、�/span>

M0/0.25

0.125±0.025

M0/0.5

0.25±0.05

M0/1

0.50±0.10

M0.5/1

0.75±0.15

M1/2

1.50±0.22

M2/4

3.0±0.3

M3/6

4.5±0.45

M4/8

6.0±0.6

M5/10

7.5±0.75

M6/12

9.0±0.9

M8/16

12.0±1.2

M10/20

15.0±1.5

M15/25

20.0±2.0

M20/30

25.0±2.5

M25/35

30.0±3.0

M30/40

35.0±3.5

M35/55

45.0±4.5

M40/60

50.0±5.0