Si-on-金刚矲�/p>

基于键合技术实现了金刚石基硅复合衬底，有望解决高功率密度硅器件散热能力不足的难颗�/p>

Based on the bonding technology, Si-on-diamond substrate has been realized, which is expected to solve the problem of insufficient heat dissipation of Si devices with high power density.