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眉山天乐半导?英寸SiC晶体产品标准 6-inch SiC Ingot Specification |
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序号 Item |
等级 Grade |
精选级(Z级) Zero MPD Grade |
工业级(P级) Production Grade |
测试级(D级) Dummy Grade |
|
1.晶体参数 Boule Parameters | |||||
1.1 | 晶型 Polytype |
4H-N | |||
1.2 | 表面晶向偏离?br style="box-sizing: border-box;"/>Surface orientation error | Off axis?.0°toward<11-20>±0.5°,On axis:<0001>±0.5° | |||
2.电学参数 Electrical Parameters | |||||
2.1 | 掺杂剁br style="box-sizing: border-box;"/>Dopant | Nitrogen | |||
2.2 | 电阻玆br style="box-sizing: border-box;"/>Resistivity | 0.015-0.028Ω·cm | |||
3.机械参数 Mechanical Parameters | |||||
3.1 | 直径 Diameter |
149.5mm-150.0mm | |||
3.2 | 厚度 Thickness |
?5mm | |||
3.3 | 主定位边方向 Primary Flat Orientation |
{10-10}±5° | |||
3.4 | 主定位边长度 Primary Flat Length | Ingot flat length | 47.5mm±2.0mm | ||
Seed flat length | None | ||||
4.结构 Structure | |||||
4.1 | 微管密度 Micropipe density |
?.1cm-2 | ?.2cm-2 | ?5cm-2 | |
4.2 | 螺位锘br style="box-sizing: border-box;"/>TSD | ?00cm-2 | ?00cm-2 | ?000cm-2 | |
4.3 | 基平面位锘br style="box-sizing: border-box;"/>BPD | ?00cm-2 | ?00cm-2 | / | |
4.4 | 刃位锘br style="box-sizing: border-box;"/>TED | ?000cm-2 | ?000cm-2 | / | |
5.晶体质量 Ingot Quality | |||||
5.1 | 六方空洞 Hex plate |
None | Cumulative area ?.1% | ||
5.2 | 划痕 Scratches |
None | Cumulative length ?x wafer diameter | ||
5.3 | 缺口/崩边/裂纹/疵点/沾污 Edge chips/indents/cracks/stains/contamination | None | ?.2 mm | ? ?mm width and depth | |
5.4 | 目测包裹?br style="box-sizing: border-box;"/>Visual carbon inclusion | None | Cumulative area ?.05% | Cumulative area ?% | |
5.5 | 多型 Polytype areas |
None | None | Cumulative area ?% | |
6.边缘轮廓 Edge | |||||
6.1 | 边缘裂纹 Edge Cracks |
None | None | Cumulative length ?0mm, single length ? mm |
|
7.包装 Packaging | |||||
7.1 | 晶锭标记 Ingot Marking(carbon side) |
Carbon face label | |||
7.2 | 包装 Packaging |
单晶锭包裄br style="box-sizing: border-box;"/>Single Ingot Package | |||
Notes: None means no request. |
眉山天乐半导?英寸SiC晶体产品标准 6-inch SiC Ingot Specification |
|||||
序号 Item |
等级 Grade |
精选级(Z级) Zero MPD Grade |
工业级(P级) Production Grade |
测试级(D级) Dummy Grade |
|
1.晶体参数 Boule Parameters | |||||
1.1 | 晶型 Polytype |
4H-N | |||
1.2 | 表面晶向偏离?br style="box-sizing: border-box;"/>Surface orientation error | Off axis?.0°toward <11-20>±0.5°,On axis:<0001>±0.5° | |||
2.电学参数 Electrical Parameters | |||||
2.1 | 掺杂剁br style="box-sizing: border-box;"/>Dopant | Nitrogen | |||
2.2 | 电阻玆br style="box-sizing: border-box;"/>Resistivity | 0.015-0.028Ω·cm | |||
3.机械参数 Mechanical Parameters | |||||
3.1 | 直径 Diameter |
149.5mm-150.0mm | |||
3.2 | 厚度 Thickness |
?5mm | |||
3.3 | 主定位边方向 Primary Flat Orientation |
{10-10}±5° | |||
3.4 | 主定位边长度 Primary Flat Length | Ingot flat length | 47.5mm±2.0mm | ||
Seed flat length | None | ||||
4.结构 Structure | |||||
4.1 | 微管密度 Micropipe density |
?.1cm-2 | ?.2cm-2 | ?5cm-2 | |
4.2 | 螺位锘br style="box-sizing: border-box;"/>TSD | ?00cm-2 | ?00cm-2 | ?000cm-2 | |
4.3 | 基平面位锘br style="box-sizing: border-box;"/>BPD | ?00cm-2 | ?00cm-2 | / | |
4.4 | 刃位锘br style="box-sizing: border-box;"/>TED | ?000cm-2 | ?000cm-2 | / | |
5.晶体质量 Ingot Quality | |||||
5.1 | 六方空洞 Hex plate |
None | Cumulative area ?.1% | ||
5.2 | 划痕 Scratches |
None | Cumulative length ?x wafer diameter | ||
5.3 | 缺口/崩边/裂纹/疵点/沾污 Edge chips/indents/cracks/stains/contamination | None | ?.2 mm | ? ?mm width and depth | |
5.4 | 目测包裹?br style="box-sizing: border-box;"/>Visual carbon inclusion | None | Cumulative area ?.05% | Cumulative area ?% | |
5.5 | 多型 Polytype areas |
None | None | Cumulative area ?% | |
6.边缘轮廓 Edge | |||||
6.1 | 边缘裂纹 Edge Cracks |
None | None | Cumulative length ?0mm, single length ? mm |
|
7.包装 Packaging | |||||
7.1 | 晶锭标记 Ingot Marking(carbon side) |
Carbon face label | |||
7.2 | 包装 Packaging |
单晶锭包裄br style="box-sizing: border-box;"/>Single Ingot Package | |||
Notes: None means no request. |
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