产品简今/div>
1. RDL
规格?/span>９/span>
Item |
Single Side RDL |
Double Side RDL |
Min Si Thickness |
60um |
60um |
Copper Thickness |
>6um |
>6um |
Copper Line/Space |
Min 10um/10um |
Min 10um/10um |
Chip Size |
Target ±20um |
Target ±20um |
Min Chip Size |
0.6mm×0.3mm |
0.6mm×0.3mm |
Tape&Reel |
Min die thickness 90um |
Min die thickness 90um |
结构示意图：
2. TSV
规格书：
Item |
TSV 10:100 |
TSV 20:200 |
Wafer size |
300mm |
300mm |
Si Thickness |
100um±10um |
200um±10um |
Via size |
10um±1.5um |
20um±3um |
Metal layers |
Top side? |
Top side? |
Copper Line/Space |
Min 10um/10um |
Min 10um/10um |
Micro Bump Pitch |
Min 40um |
Min 40um |
结构示意图：
3. Bumping
规格书：
Item |
Wafer Bumping |
Wafer Size |
300mm/200mm |
Bump Pitch |
Min 80um |
Bump Size |
Min 50um |
Bump Height |
<80um |
RDL Line/Space |
Min 10um/10um |
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