产品概述/Product Introduction９�/span>

� 该设备是半导体生产线前工序的重要工艺设备之一，用于大规模集成电路、分立器件、电力电子、光电器件等行业的扩散、氧化、退火、合金和烧结等工艹�/p>

This equipment is one of the important process equipments in the front process of semiconductor production line, which is used for diffusion, oxidation, annealing, alloying and sintering in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices.

� 设计了硅片生产的多种工艺性能需要，具有生长效率高、产品性能优越的特炸�/p>

The design takes into account various process performance requirements of silicon wafer production, and has the characteristics of high growth efficiency and superior product performance.

� 具有污染低、占地面积小、温度均匀、可装载晶圆尺寸大、工艺稳定性高等优炸�/p>

It has the advantages oflow pollution, small occupied area, uniform temperature, large wafer size and high process stabili-

� 主要用于初始氧化层、屏蔽氧化层、衬垫氧化层、牺牲氧化层、场氧化层等多种氧化介质层的制备工艺

Mainly used in the preparation process of various oxidation dielectric layers such as initial oxide layer, shielding oxide layer, gasket oxide layer, sacrificial oxide layer and field oxide layer.